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LHF08CTE
4
Individual block locking uses a combination of bits,
sixteen block lock-bits and a master lock-bit, to lock
and unlock blocks. Block lock-bits gate block erase
and byte write operations, while the master lock-bit
gates block lock-bit modification. Lock-bit
configuration operations (Set Block Lock-Bit, Set
Master Lock-Bit, and Clear Block Lock-Bits
commands) set and cleared lock-bits.
The status register indicates when the WSM’s block
erase, byte write, or lock-bit configuration operation is
finished.
The RY/BY# output gives an additional indicator of
WSM activity by providing both a hardware signal of
status (versus software polling) and status masking
(interrupt masking for background block erase, for
example). Status polling using RY/BY# minimizes
both CPU overhead and system power consumption.
When low, RY/BY# indicates that the WSM is
performing a block erase, byte write, or lock-bit
configuration. RY/BY#-high indicates that the WSM is
ready for a new command, block erase is suspended
(and byte write is inactive), byte write is suspended,
or the device is in deep power-down mode.
The access time is 85ns (t AVQV ) over the extended
temperature range (-40°C to +85°C) and V CC supply
voltage range of 4.75V-5.25V. At lower V CC voltages,
the access times are 90ns (4.5V-5.5V), 120ns
(3.0V-3.6V) and 150ns (2.7V-3.6V).
The Automatic Power Savings (APS) feature
substantially reduces active current when the device
is in static mode (addresses not switching). In APS
mode, the typical I CCR current is 1 mA at 5V V CC .
When CE# and RP# pins are at V CC , the I CC CMOS
standby mode is enabled. When the RP# pin is at
GND, deep power-down mode is enabled which
minimizes power consumption and provides write
protection during reset. A reset time (t PHQV ) is
required from RP# switching high until outputs are
valid. Likewise, the device has a wake time (t PHEL )
from RP#-high until writes to the CUI are recognized.
With RP# at GND, the WSM is reset and the status
register is cleared.
The device is available in 40-lead TSOP (Thin Small
Outline Package, 1.2 mm thick). Pinout is shown in
Figure 2.
Rev. 1.3
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